Ucreate LTD PCB's aim
1.Products Application2. Market Distribution
3.Technical CapabilitiesItemsSpeci.RemarkMax panel size32" x 20.5"(800mm x 520mm)Min trace width/ space (inner layer)4mil/4mil(0.1mm/0.1mm)Min PAD (inner layer)5 mil(0.13mm)hole ring widthMin thickness(inner layer)4 mil(0.1mm)without copperInner copper thickness1~4 ozOuter copper thickness0.5~6 ozFinished board thickness0.4-3.2 mm
Board thickness tolerance control±0.10 mm&plusmBeauty Equipment n;0.10 mm1~4 L±10%±10%6~8 L±10%±10%≥10 LInner layer treatmentbrown oxidationLayer count Capability1-30 LAYERalignment between ML±2milMin drilling0.15 mmMin finished hole0.1 mmHole precision±2 mil(±50 um)tolerance for Slot±3 mil(±75 um)tolerance for PTH±3 mil(±75um)tolerance for NPTH±2mil(±50um)Max Aspect Ratio for PTH8:1Hole wall copper thickness15-50umAlignment of outer layers4mil/4milMin trace width/space for outer layer4mil/4milTolerance of Etching+/-10%Thickness of solder maskon trace0.4-1.2mil(10-30um)at trace corner≥0.2mil(5um)On base material≤+1.2mil
Finished thicknessHardness of solder mask6HAlignment of solder mask film±2mil(+/-50um)Min width of solder mask bridge4mil(100um)Max hole with solder plug0.5mmSurface finishHAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.Max Nickel thickness for Gold finger280u"(7um)Max gold thickness for Gold finger30u"(0.75um)Nickel thickness in Immersion Gold120u"/240u"(3um/6um)Gold thickness in Immersion Gold2u"/6u"(0.05um/0.15um)Impedance control and its tolerance50±10%,75±10%,100±10% 110±10%Trace Anti-stripped strength≥61B/in(≥107g/mm)bow and twist
0.75%
4.Products Equipment